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Semiconductor & MEMS Process Services

MEMS

Process services on 4-, 6-, and 8-inch silicon or glass wafers

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Core Process Services

We provide front-end foundry services for semiconductor and MEMS device fabrication.

Photolithography
Photolithography · Precision patterning from mask alignment through exposure and development, supporting 4- to 8-inch wafers
Etching
Wet and dry etching with high selectivity for silicon, oxide, metal, and other materials
Electroplating
Multilayer metal plating of Cu, Ni, Au, and Pt. Specialized process for Copper Post Bump and RDL formation
Anodic Bonding
Silicon-to-glass direct bonding. A high-reliability bonding process essential for MEMS packaging of sensors, actuators, and more
SOI Wafer Fabrication
In-house fabrication and supply of Silicon-on-Insulator wafers for high-performance sensors, RF devices, and MEMS substrates.
TSV / TGV Interposer
Fabrication of Through-Silicon Via and Through-Glass Via interposers. Advanced interconnect technology for high-density heterogeneous integration.

Manufacturing Flow

A systematic foundry process from design request to finished product shipment

01 Technical Consultation & Design Review
Analysis of customer requirements, process feasibility review, and optimal process proposals
02 Mask Fabrication
Chrome or emulsion mask fabrication. Precision lithography masks for high-resolution patterning
03 Raw Material Preparation
Customer-supplied or in-house processed materials
04 Process
Core processes including photolithography, etching, deposition, and plating
05 Inspection & Shipment
Wafer inspection and shipment with a quality report

Product Portfolio

We supply key devices for semiconductor and MEMS packaging, from design through fabrication.

Test Element Group

We provide Test Element Group wafers and design files for process verification.

DXF Design File Supply
TEG layout DXF files for each product, including SOIWA, CPBT, TGVI, and TSVI, to support design verification
Process Monitoring TEG
Includes electrical test structures for monitoring process variables such as resistance, contacts, and via chains. Real-time tracking of process stability
Custom TEG Design
TEG structures can be customized to customer specifications, including proposals to optimize die area utilization
Measurement Data Report
Wafer-level electrical measurement results and yield analysis reports, supporting a feedback loop for process optimization