History

1. 2023

   • 2023 Trademark registration

     • CPBT (Copper Post Bump TEG)
     • TSVi (TSV interposer)
     • TGVi (TGV interposer)
     • SOIwa (SOI wafer)
2. 2022

   • 2022 ISO 9001:2015 certification

3. 2021

   • Expansion of CMP and SOI manufacturing line (8 inch)

   • Patent (No. 10-2200437) Manufacturing method of through-electrodes

   • Participated in DAPA localization support program (gyro sensors and controllers for Haegung / Cheongung II seekers)

4. 2020

   • Relocated headquarters to Dongtan, Hwaseong-si, Gyeonggi-do (The First Tower 2)

   • Patent registration (No. 10-2174361, multilayer stacked antenna and manufacturing method)

5. 2019

   • Patent registration (No. 10-2174361, multilayer stacked antenna manufacturing technology)

6. 2017

   • Participated in MOTIE civil-military cooperation project (Low Beam Squint beamforming technology development)

   • Gyeonggi Regional Research Center (GRRC) project (convergence sensor materials and process platform)

   • Accredited as a corporate R&D center

7. 2016

   • Established CMP and SOI wafer manufacturing line and commenced sales (4.6 inch)

8. 2014

   • R&D and foundry services for Samsung SAIT and 300+ companies

9. 2013

   • Relocated headquarters (Pacman Suwon Am-ri)

   • Gyeonggi-do subsidized technology development project (LINC)

10. 2012

    • Participated in Regional Specialized Industry Promotion Project (2012–2014, smart component plating industry support)

    • Venture company certification

11. 2011

    • Established EPG Co., Ltd. (Sungkyunkwan University Comprehensive Research Building, Suwon)

    • Commenced business with first customers including Samsung SAIT, Pusan National University, KOMICO, and ISC

    • Participated in TP-BI linkage utilization project

    • Participated in Technology Doctor program (Gyeonggi TP) – silicon interposer manufacturing technology support

EPG History